Entries by Phillip Isenhart

Executives from Siemens, Qualcomm and Samsung Join Si2 Board of Directors

AUSTIN, Texas—Silicon Integration Initiative, a leading research and development joint venture that provides standard interoperability solutions for semiconductor design tools, announced today the election of its 2020-2021 board of directors. Joining the Si2 board this year are: Juan C. Rey, vice president of Engineering, Mentor, a Siemens Business Pankaj Kukkal, vice president, EDA, Emulation and […]

Jeff Brubaker of Synopsys Joins Si2 OpenAccess Change Team

Jeff Brubaker, infrastructure architect for Custom Compiler at Synopsys, has been elected to the Si2 OpenAccess Change Team. OpenAccess, the world’s most widely used, open-reference database for IC design, creates authentic interoperability between EDA companies and semiconductor designers and manufacturers. Jeff started working on custom design tools at Avanti in 2000 and joined Synopsys in […]

Si2 Launches Survey on Artificial Intelligence and Machine Learning in EDA

Si2 has launched an industry-wide survey to identify planned usage and structural gaps for prioritizing and implementing artificial intelligence and machine learning in semiconductor electronic design automation. The survey is organized by a recently formed Si2 Special Interest Group chaired by Joydip Das, senior engineer, Samsung Electronics, and co-chaired by Kerim Kalafala, senior technical staff […]

Support for OpenAccess 22.50 Ends in June

Effective June 1, 2020, OpenAccess 22.50 (DM5) will no longer be supported and no further source code changes will be made. What this means for OpenAccess Coalition Members The present OA 22.50 releases will be available for the near future, although members should consider plans to migrate to the new OpenAccess 22.60 (DM6). The migration […]

Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model

The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies. L-UTSOI was selected for support by CMC, a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of […]

Samsung Executive Joins Si2 Board of Directors

Jung Yun Choi, corporate vice president for the Samsung Electronics Design Technology team, has been elected to the Silicon Integration Initiative board of directors. A 17-year Samsung veteran, Choi leads the team responsible for developing all design tools and methodologies for Samsung memory products: technologies and environments impacting product values, new process and package technologies, […]

SI2 Launches Special Interest Group For AI and ML in Electronic Design Automation

SIG Will Fill Industry Gaps to Enable Artificial Intelligence and Machine Learning in EDA Silicon Integration Initiative has launched a special interest group to focus on the growing needs and opportunities in artificial intelligence and machine learning for electronic design automation. The group will identify current solutions and technology gaps in AI and ML strategies […]

New Version of Si2 oaScript Expands IC Design Capabilities into the Cloud and AI

Design partitioning and multi-threaded parallel execution are key features of the updated scripting interface to OpenAccess, the industry’s most widely used IC design database. oaScript Version 4.0—developed by programming experts in the Silicon Integration Initiative oaScript Working Group—leverages the powerful enhancements available to OpenAccess in its most recent Data Model 6 upgrade. “Our oaScript Working […]

Qualcomm Executive Joins Si2 Board of Directors

Pankaj Kukkal, vice president of Engineering at Qualcomm Inc., has been elected to the Silicon Integration Initiative board of directors. Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools. In his current role, Kukkal oversees all EDA, emulation and post-silicon engineering functions for mobile, compute, […]

Si2 Compact Model Coalition Releases BSIM-CMG SPICE Model for Advanced IC Designs

CMC Members Benefit from 18-Month Early Access to New Standard Model AUSTIN, Texas — The Si2 Compact Model Coalition has released the latest version of BSIM-CMG FinFET, a standard compact SPICE model developed by researchers at the University of California, Berkeley, in conjunction with 20 partners from many of the industry’s leading semiconductor companies. CMC […]