Si2 Workshop Explores Global Effort to Measure AI Compute Capacity and Infrastructure

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An international effort to assess artificial intelligence compute capacity and help governments make informed AI infrastructure investments is the focus of an online workshop hosted by Silicon Integration Initiative, January 29, 8:00-10:00 am PST.

Keith Strier, vice president, Worldwide AI Initiatives at NVIDIA, will discuss the AI Compute Task Force created in early 2020 by the Organisation for Economic Co-operation and Development. The OECD is a Paris-based intergovernmental economic group with 37 member countries, founded in 1961 to stimulate economic progress and world trade. The task force is developing a framework to measure and benchmark domestic AI compute capacity and other AI readiness components, including budgets and investment priorities.

Their work could also address concerns that wealthier countries are making outsized investments in AI compute capacity, possibly leading to a global compute divide that will sustain resource inequalities in a global digital economy. Strier chairs the OECD task force and has primary responsibility for the NVIDIA global public sector portfolio and the AI Nations Partnership Initiative. He also advises national and city government leaders on AI policies and infrastructure.

The workshop also features Yiorgros Makris from the University of Texas at Dallas. He will discuss how machine learning can reduce semiconductor testing costs, increase test quality, improve yield and test floor logistics, and guide designers and process engineers.

Makris is a professor of Electrical and Computer Engineering and co-founder of the NSF Industry-University Cooperative Research Center on Hardware and Embedded System Security. His research focuses on applying machine learning and statistical analysis to develop trusted and reliable integrated circuits and systems, emphasizing the analog/RF domain.

The workshop will conclude with an update on the Si2 AI/ML in EDA Special Interest Group. Speakers are Joydip Das, SIG chair and senior engineer, Samsung Austin R&D Center; and Kerim Kalafala, SIG co-chair and senior technical staff member, IBM EDA.

The workshop is open to the public and registration is free. For more information visit http://bit.ly/si2_ai_workshop.

About Si2

Founded in 1988, Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools. All Si2 activities are carried out under the auspices of The National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws. The Si2 international membership includes semiconductor foundries, fabless manufacturers, and EDA companies.

Dr. Leigh Anne Clevenger Named Si2 Director, OpenStandards

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Silicon Integration Initiative has selected Dr. Leigh Anne Clevenger as director of OpenStandards, effective January 1, 2021. She will replace Jerry Frenkil, who has served in this role since 2015. Frenkil will remain with Si2 as an advisor to staff, board, and member companies on adoption of the IEEE 2416 Unified Power Modeling Standard.

Since joining Si2 in 2018, Clevenger has been the lead developer of the Si2 prototype power calculator, demonstrating the UPM/IEEE-2416 standard. She will continue to drive the UPM working group toward its goals of developing and adopting the standard. Additionally, leveraging her doctorate in Software She will continue to drive the UPM working group toward its goals of enhancement and adoption of the standard. and Machine Learning, Clevenger is currently spearheading the effort to identify and solve industry needs in applying artificial intelligence and machine learning to electronic design automation tools.

With this promotion, Clevenger will continue working directly with Si2 members and industry leaders to identify and solve issues in semiconductor design flow interoperability. As an R&D Joint Venture providing antitrust protection for its members, Si2 is uniquely positioned to organize collaborative efforts, with the ultimate goal of widespread adoption of standards providing EDA tool interoperability and customer data access.

“Starting the Special Interest Group on AI/ML in EDA served as Leigh Anne’s introduction to the role Si2 has as an R&D Joint Venture,” said John Ellis, president and CEO. “Through a series of interviews with Si2 member companies, she established a vision of the technical collaboration needed and the highest priority issues for the SIG to tackle.

“Leigh Anne has been a vital addition to our team. She added value to our operations from day one, applying her semiconductor experience to UPM coding. Following Si2’s growth path, we soon put her advanced AI/ML degree to use,” Ellis added. “The SIG she formed with industry experts is well on its way to closing some serious gaps found for effectively applying AI/ML to EDA. I look forward to what’s next for Leigh Anne. With her skills and drive, I expect great things.”

Clevenger, who earned her doctorate at Pace University, has published and presented research on data science including big data analytics, machine learning algorithms, and wearable computing. She brings to Si2 extensive experience in semiconductor design automation at IBM and semiconductor processing technology at GLOBALFOUNDRIES.

About Si2

Founded in 1988, Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools. All Si2 activities are carried out under the auspices of The National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws.

Si2 Publishes White Paper on Expanding Use of AI/ML in Semiconductor Electronic Design

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A new Silicon Integration Initiative white paper identifies a common data model as the most critical need to accelerate the use of artificial intelligence and machine learning in semiconductor electronic design automation.

The white paper, produced by a 20-member Si2 Special Interest Group, reports on findings of a global survey that identifies planned usage and structural gaps for AI and ML in EDA. It is available at  https://si2.org/product/collaborative-data-model/

Leigh Anne Clevenger, Si2 senior data scientist, said that the white paper identifies “a standard, common model for classifying and structuring machine learning and inference data as being crucial to accelerating the use of AI/ML in EDA. This data model would provide a foundation for addressing the data organization gap for chip developers, EDA tool developers, IP providers, and researchers. It would support design data and derived data for high-interest use cases.”

The survey also identifies a common reference flow, on-line AI/ML courses and organized training data as industry needs.

The white paper addresses:

  • Machine Learning and IC Design
  • Demand for Data
  • Structure of a Data Model
  • A Unified Data Model: Digital and Analog Examples
  • Definition and Characteristics of Derived Data for ML Applications
  • Need for IP Protection
  • Unique Requirements for Inferencing Models
  • Key Analysis Domains
  • Conclusions and Proposed Future Work

Member of the Si2 Special Interest Group include:

  • Advanced Micro Devices
  • Ansys
  • Cadence Design Systems
  • GLOBALFOUNDRIES
  • Hewlett Packard Enterprise
  • IBM
  • Intel Corp.
  • Intento Design
  • Keysight Technologies
  • Mentor, a Siemens Business
  • NC State University
  • PDF Solutions
  • Qualcomm
  • Samsung
  • Sandia National Laboratories
  • Silvaco
  • SK Hynix
  • Synopsys
  • Texas Instruments
  • Thrace Systems

 

Si2 Launches Survey on Artificial Intelligence and Machine Learning in EDA

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Si2 has launched an industry-wide survey to identify planned usage and structural gaps for prioritizing and implementing artificial intelligence and machine learning in semiconductor electronic design automation.

The survey is organized by a recently formed Si2 Special Interest Group chaired by Joydip Das, senior engineer, Samsung Electronics, and co-chaired by Kerim Kalafala, senior technical staff member, EDA, and master inventor, IBM. The 18-member group will identify where industry collaboration will help eliminate deficiencies caused by a lack of common languages, data models, labels, and access to robust and categorized training data.

This SIG is open to all Si2 members. Current members include:

  • Advanced Micro Devices
  • ANSYS
  • Cadence Design Systems
  • Hewlett Packard Enterprise
  • IBM
  • Intel
  • Intento Design
  • Keysight Technologies
  • Mentor, a Siemens Business
  • NC State University
  • PFD Solutions
  • Qualcomm
  • Samsung Electronics
  • Sandia National Laboratories
  • Silvaco
  • Synopsys
  • Thrace Systems
  • Texas Instruments

The survey is open April 15 – May 15.

The survey link is:  https://bit.ly/SI2_AI_ML_Survey

Leigh Anne Clevenger, Si2 senior data scientist, said that the survey results would help prioritize SIG activities and timelines. “The SIG will identify and develop requirements for standards that ensure data and software interoperability, enabling the most efficient design flows for production,” Clevenger said. “The ultimate goal is to remove duplicative work and the need for data model translators, and focus on opening avenues for breakthroughs from suppliers and users alike.”

“High manufacturing costs and the growing complexity of chip development are spurring disruptive technologies such as AI and ML,” Clevenger explained. “The Si2 platform provides a unique opportunity for semiconductor companies, EDA suppliers and IP providers to voice their needs and focus resources on common solutions, including enabling and leveraging university research.