Colin Shaw of Silvaco Named Si2 Pinnacle Award Winner

Colin Shaw, senior corporate applications engineer at Silvaco, has received the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.

A chartered engineer with over 30 years of semiconductor industry experience, Shaw serves as chair of six Si2 Compact Model Coalition working groups and vice-chair of three others. His expertise includes the production and development of device processes for silicon and II-V compounds, as well as device and circuit design covering test structures, SRAM, IGBT and SAW filters.

For 25 years, CMC has offered semiconductor manufacturers, designers, and simulation tool providers an avenue to collectively fund, develop and optimize standard compact SPICE models and interfaces to promote simulation tool interoperability. CMC funds and supports select university and national laboratory compact model developers to achieve these goals.

“Colin has been a driving force within CMC since its integration with Si2 in 2013,” said John Ellis, Si2 president and CEO. “From leading the working group that created an open, industry-standard model simulator interface, to chairing our two recent gallium nitride and silicon carbide efforts, he has been a consistent coalition leader and team player. This combination of vision and commitment makes Colin truly deserving of the Si2 Pinnacle Award.”

Shaw will present at the quarterly CMC meetings scheduled for December 7-10.

About the Silicon Integration Initiative

Si2 is a leading R&D joint venture that provides standard interoperability solutions for IC design tools. Its primary programs include CMC and OpenAccess, the world’s most widely used open reference database for IC design, with a supporting standard APA. All Si2 activities are carried out under the auspices of the National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws.

Si2 Launches TITAN Initiative Advancing Silicon-to-System Technology Interoperability

Plans to Address Challenges Posed by Duality of Moore’s Law and  More than Moore 3D-IC Trends in Vertical Markets

Silicon Integration Initiative has launched the Technology Interoperability Trajectory Advisory CouNcil, a thought leadership collaboration to drive industry growth in crucial vertical semiconductor markets.

TITAN will work with Si2 member companies to explore a spectrum of technology interoperability gaps between electronic design automation suppliers, cloud providers, foundries, semiconductor and emerging silicon-to-system companies. TITAN will generate consensus on technology interoperability in workflows and advise the Si2 board of directors on high-level trends and realizable solutions. In addition, TITAN will bridge established Si2 programs such as the OpenAccess, Compact Model and OpenStandards Coalitions, and Special Interest Groups.

TITAN founding members include Ansys, Arm, Cadence Design Systems, Google, IBM, Intel, Microsoft, Qualcomm Technologies, Samsung Electronics, Siemens EDA, Silvaco, SK hynix and Synopsys.

John Ellis, Si2 president and CEO, said, “New capabilities empowered by AI, IoT, hyperscale computing, automotive and 5G/6G are driving the digital transformation toward a semiconductor industry renaissance. The complexity of designing and integrating these diverse technologies into current and future systems requires not only interoperability for multi-physical-domain system design software but also unambiguous means of securely controlling and sharing the private data required for implementing an efficient, connected and extensible environment.”

Vic Kulkarni, Si2 chief strategy officer, said, “Our industry ecosystem is transitioning workflows from the silicon-centric to the silicon-to-system-centric worlds. TITAN unites technology thought leaders to identify and address challenges in silicon-to-system design implementation, particularly in a cloud environment compatible with AI and ML in crucial vertical markets. The primary goal for TITAN is to accelerate innovation through industry collaboration to achieve faster time to results and time to market.

“TITAN will serve as the trusted technology advisor to the Si2 board of directors, which evaluates and forwards proposals to Si2 technology teams for prioritization and action plans. Council members will determine the best path forward for industry collaboration and commit resources to develop and prototype gap technologies,” Kulkarni added.

Kerim Kalafala, senior technical staff member at IBM Systems Group and TITAN interim chair, said, “I am looking forward to working with TITAN member companies to address the top priorities which were shared during the recent TITAN launch. These include the secure processed data SPEED API for cloud interoperability, high-level workflows for 2.5D/3D-IC advanced packaging, and challenges in EDA workflows for complex chip designs addressing the key vertical markets.”

TITAN participation is open to Si2 members. For more information, visit https://si2.org/TITAN, or contact Kulkarni at vic.kulkarni@Si2.org.

Joydip Das of Samsung Named Si2 Pinnacle Award Winner

Joydip Das, staff engineer at Samsung Austin Research & Development Center in Austin, Texas, has received the quarterly Silicon Integration Initiative Pinnacle Award. This award recognizes volunteers for their exceptional contributions to Si2’s success as a leading semiconductor R&D joint venture.

Das was selected for his contributions to the Si2 AI/ML in EDA Special Interest Group, which he chaired since its creation in October 2019. Under his guidance, the group wrote three white papers, conducted a successful industry survey, offered an AI/ML workshop with over 100 attendees, and delivered five conference papers.

“Joydip has proven to be an exceptional leader, forming subgroups to accomplish deliverables on topics of interest to our member companies. He encourages participation by professors and graduate students, helping the SIG recruit over 20 member companies and universities,” said Leigh Anne Clevenger, Si2 director of OpenStandards.”

Das earned his Ph.D. in Applied Science from the Department of Electrical & Computer Engineering at the University of British Columbia (UBC), Vancouver, Canada. He has publications in peer-reviewed IEEE and ACM journals and conferences.

About the Silicon Integration Initiative

Si2 is a leading research and development joint venture that provides standard interoperability solutions for IC design tools. Its primary products include OpenAccess, the world’s most widely used, open-reference database for IC design, and the Compact Model Coalition, which provides an avenue to fund standard compact SPICE models and standard interfaces for simulation tool interoperability.

Authors of AI/ML White Paper Win Annual Si2 Power of Partnerships Award

Presentation set during Si2 Annual Technology Forum

Authors of a groundbreaking Silicon Integration Initiative white paper identifying a common data model as the most critical need to accelerate artificial intelligence and machine learning in semiconductor electronic design automation are winners of the 2021 Si2 Power of Partnerships Award.

The annual awards recognize the Si2 volunteer team that has made the most significant contributions to EDA innovation and efficiency. Si2 will present the awards at the Si2 Annual Technology Forum, Friday, August 6, 8:00 a.m. – 10:00 a.m. Pacific Standard Time. Speakers will focus on semiconductor design-in-the-cloud strategies. The forum is open to the public and admission is free.

The white paper, produced by an Si2 Special Interest Group, reports on findings of a global survey that identifies planned usage and structural gaps for AI and ML in EDA. It is available for download at: https://si2.org/ai-ml-downloads/

Leigh Anne Clevenger, Si2 director of OpenStandards, said that the white paper identifies “a standard, common model for classifying and structuring machine learning and inference data as crucial to accelerating the use of AI/ML in EDA. This data model would provide a foundation for addressing the data organization gap for chip developers, EDA tool developers, IP providers, and researchers. It would support design data and derived data for high-interest use cases.”

The white paper also identified a common reference flow, online AI/ML courses and organized training data as industry needs.

“Brought together by their shared interest in artificial intelligence and machine learning, the authors shared their unique perspectives and experience to emphasize the importance of data to any ML solution for EDA,” Clevenger said.

Power of Partnerships winners for 2021 are:

  • Kerim Kalafala, IBM, Chair
  • Veeravanallur Parthasarathy, Advanced Micro Devices
  • Norman Chang, Ansys
  • Akhilesh Kumar, Ansys
  • Elias Fallon, Cadence Design Systems
  • Sriram Madhavan, GLOBALFOUNDRIES
  • Prateek Bhansali, Intel
  • Srinivas Bodapati, Intel
  • Chandramouli Kashyap, Intel
  • James Masters, Intel
  • Ramy Iskander, Intento Design
  • Larg Weiland, PDF Solutions
  • Karthik Aadithya, Sandia National Laboratory
  • Boon-Siang Cheah, Synopsys
  • Mengdi He, Synopsys

Based on member and officer recommendations, Si2 executives submit nominations for the Power of Partnerships Award from which the Si2 board of directors then selects the winners.

Runners-up for 2021 are:

Compact Model Coalition, Open Model Interface Working Group
Colin Shaw, Chair, Silvaco

Contributed to Si2 initially by Taiwan Semiconductor Manufacturing Company, OMI is built around the TSMC Model Interface. OMI allows circuit designers to simulate and analyze such significant physical effects as self-heating and aging, and to perform extended design optimizations, including statistical modeling of process variations.

OpenAccess Coalition, Polygon Operators Working Group
James Masters, Chair, Intel

The Polygon Operators Working Group develops oaxPop, an API extension used with Si2 OpenAccess, the world’s most widely used open reference database for IC design. Originally contributed to Si2 by Intel, oaxPop brings the power of the popular Boost Polygon Library into the expanding OpenAccess design database ecosystem.

Hongmei Li Named IBM Representative to Si2 OpenAccess Coalition

Hongmei Li is the new IBM representative to the Si2 OpenAccess Coalition.  Li currently manages the Product Design Enablement Group in the IBM electronic design automation organization. She replaces Paul Stabler, a long-time supporter of OpenAccess activities, who is retiring from IBM.

Over her 17-year IBM career, Li has worked on radio-frequency MOSFET and passive device models, gate resistance characterization, de-embedding methodology for RF measurement, FET local layout effect, 3D through-silicon-via stress modeling, test site macro design and test site coordination. Starting August 1, she will manage the EDA Technology Enablement & ChipBench Group.

Li received a Ph.D. in Electrical Engineering from the University of Illinois at Champaign-Urbana in 2004.

Si2 OpenAccess, the world’s most widely used, open-reference database for IC design, creates authentic interoperability between EDA companies and semiconductor designers and manufacturers.

Views from the Cloud: Si2 Annual Technology Forum

The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. – to 10:00 a.m. Pacific Standard Time.

Registration is free. For details click here.

Silicon Integration Initiative is an R&D joint venture providing standard interoperability solutions for semiconductor design tools. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

AGENDA

Keynote PresentationSilicon-to-System – Addressing Design, Verification, and Implementation Challenges with Cloud-Based Engineering

David Pellerin
Head of Worldwide Business Development
Hitech/Semiconductor
Amazon Web Services


Executive Panel Discussion:
EDA-in-the-Cloud Challenges are Already Solved by Providers

Kerim Kalafala
Senior Technical Staff Member
IBM

Ramond Rodriguez
Senior Director of Strategic CAD Capabilities
Intel

Dr. Rhett Davis
Professor of Computer and Electrical Engineering
NC State University

Rajeev Jain
Senior Director of Technology
Qualcomm


Si2 Technical Coalition Updates

OpenAccess, oaScript Extensions
Marshall Tiner
Si2 Director of Production Standards

Standard Compact Models
John Ellis
Si2 President and CEO

AI/ML, Unified Power Models
Dr. Leigh Anne Clevenger
Si2 Director of OpenStandards

Special Announcement

Learn about a new Si2 industry initiative focusing on silicon-to-system design interoperability

Vic Kulkarni
Si2 Chief Strategy Officer


Annual Power of Partnerships Award

Presented to the Si2 team that has made the most significant contributions to the field of electronic design automation

 

Executives from Cadence, SK Hynix Join Si2 Board of Directors

AUSTIN, Texas—Silicon Integration Initiative, a leading research and development joint venture providing standard interoperability solutions for semiconductor design tools, announced today the election of its board of directors for 2021-2022.

Joining the Si2 board for their first full terms are:

  • Aparna Dey, Senior Product Marketing Group Director, Cadence Design Systems
  • Do Chang-Ho, Vice President, Computer Aided Engineering Division, SK Hynix

Re-elected board members are:

  • Richard Trihy, vice president, Design Enablement, GLOBALFOUNDRIES
  • Roger Carpenter, hardware engineer, Google
  • Leon Stok, vice president, Electronic Design Automation Technologies, IBM
  • Rahul Goyal, vice president, Intel Corp., director, R&D Strategic Enablement
  • Pankaj Kukkal, vice president, EDA, Emulation and Post-Silicon Engineering, Qualcomm Technologies
  • Jung Yun Choi, corporate vice president, Electronics Design Technology, Samsung Electronics
  • Juan C. Rey, vice president of engineering, Calibre, Siemens EDA
  • David DeMaria, corporate vice president, Strategic Initiatives and Market Intelligence, Synopsys
  • Keith Green, distinguished member of the technical staff, Texas Instruments

The board elected prior board member, John Lee, general manager and vice-president, Ansys, as an ex-officio board member. Lee will advise the board with regards to Si2’s long-term strategy for design-in-the-cloud, as well as for artificial intelligence and machine learning-enabled design.

The Si2 board represents leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

About Si2

Founded in 1988, Si2 provides standard interoperability solutions for semiconductor design tools. All Si2 activities are carried out under the auspices of the National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws.

 

Si2 Releases New Version of oaScript Extension

Si2 has released oaScript v4.1, which contains a number of improvements to the script versions of the OpenAccess API:

  •  New oaByteArray versions of oaParam::getAppVal/oaParam::setAppVal
  • ·Support for Python-3.8, Python-3.9 and Ruby-2.7
  • New HTML language-specific documentation
For more information contact Marshall Tiner, director of Production Standards, mtiner@si2.org.

Peter Lee of Micron Tapped for Si2 Pinnacle Award

Peter Lee, director of a global team responsible for the DRAM design environment at Micron Technology, will receive the quarterly Silicon Integration Initiative Pinnacle Award. This award recognizes volunteers for their exceptional contributions to Si2’s success as a leading semiconductor R&D joint venture.

Lee serves as chair of the Si2 Compact Model Coalition, an international group that supports the development of standard compact SPICE models and standard interfaces to promote simulation tool interoperability. He has led the CMC since 2016, during which time the group has partnered with leading universities and research labs to fund four new device models and 11 existing standard models adopted by semiconductor manufacturers, designers and simulation tool providers. The CMC has consistently increased overall funding to model developers under Lee’s chairmanship.

Lee has more than 30 years of device modeling and circuit-level reliability simulation experience at Micron, Elpida Memory, Renesas Technology, and Hitachi. He earned his Ph.D. in Electrical Engineering from the University of California at Berkeley and is a senior member of the IEEE.

John Ellis, Si2 president and CEO, stated, “Peter has been a leader within the CMC since they first joined forces with Si2 in 2013, first as co-chair and then as chair. It’s a pleasure to work with Peter and recognize him publicly for his diligent effort in guiding this prestigious group. Si2 is grateful to Micron for enabling Peter to continue his efforts within the CMC.”

About the Compact Model Coalition

Now in its 25th year, the Si2 Compact Model Coalition provides semiconductor manufacturers, designers, and simulation tool providers an avenue to pool resources to fund standardization and optimization of standard compact SPICE models and standard interfaces to promote simulation tool interoperability. CMC funds and supports select university and national laboratory compact model developers. The CMC quality assurance program ensures that simulations are accurate and uniform across different vendors. The world’s most advanced semiconductor designs are designed and simulated using the standards funded by the CMC.

About the Silicon Integration Initiative

Si2 is a leading research and development joint venture that provides standard interoperability solutions for IC design tools. Its primary products include OpenAccess, the world’s most widely used, open reference database for IC design, with a supporting standard APA. All Si2 activities are carried out under the auspices of the National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws.

Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model

The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors. Featuring high efficiency and fast operation with low switching losses, silicon carbide-based metal-on-silicon-field effect transistors are popular in high-growth semiconductor applications such as photovoltaic inverters and converters, industrial motor drives, electric vehicle powertrain and EV charging, and power supply and distribution.

 

Peter Lee

A CMC working group will oversee the model development as part of advancing Si2’s mission to reduce interoperability costs, said Peter Lee, CMC chair. Participating companies include Analog Devices, Cadence Design Systems, Infineon, Qualcomm, Siemens EDA, Silvaco and Synopsys. The decision to launch the working group came after the CMC evaluated the model’s ROI for members and interest by the industry at large. “I’d encourage companies with a stake in SiC devices to join this effort and help guide selection of the model which best represents their intended use,” advised Lee. “They can benefit from both cost reduction that comes from shared model support and a standardized and qualified model that has ongoing bug fixes and requested feature enhancements from many like-minded companies.”

 

Colin Shaw

“Next Generation SiC MOSFETS has many features that make them suitable, and even superior to legacy silicon solutions, for several high voltage applications. While the devices can handle high-temperature and voltage, its minimal ON-resistance allows smaller packages and better energy savings than comparable silicon devices,” stated Colin Shaw from Silvaco, the working group chair.

 

 

 

 

About the Compact Model Coalition

Now in its 25th year, the Si2 Compact Model Coalition provides semiconductor manufacturers, designers, and simulation tool providers a means to pool resources to fund standardization and optimization of standard compact SPICE models and standard interfaces to promote simulation tool interoperability. CMC funds and supports select university and national laboratory compact model developers. The CMC quality assurance program ensures that simulations are accurate and uniform across different vendors. The world’s most advanced semiconductor designs are all designed and simulated using the standards funded by the CMC.

 

About the Silicon Integration Initiative (Si2)

Si2 is a leading research and development joint venture that provides standard interoperability solutions for IC design tools. Its primary products include OpenAccess, the world’s most widely used, open reference database for IC design, with a supporting standard APA. All Si2 activities are carried out under the auspices of the National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws.