Authors of AI/ML White Paper Win Annual Si2 Power of Partnerships Award

Presentation set during Si2 Annual Technology Forum

Authors of a groundbreaking Silicon Integration Initiative white paper identifying a common data model as the most critical need to accelerate artificial intelligence and machine learning in semiconductor electronic design automation are winners of the 2021 Si2 Power of Partnerships Award.

The annual awards recognize the Si2 volunteer team that has made the most significant contributions to EDA innovation and efficiency. Si2 will present the awards at the Si2 Annual Technology Forum, Friday, August 6, 8:00 a.m. – 10:00 a.m. Pacific Standard Time. Speakers will focus on semiconductor design-in-the-cloud strategies. The forum is open to the public and admission is free.

The white paper, produced by an Si2 Special Interest Group, reports on findings of a global survey that identifies planned usage and structural gaps for AI and ML in EDA. It is available for download at:

Leigh Anne Clevenger, Si2 director of OpenStandards, said that the white paper identifies “a standard, common model for classifying and structuring machine learning and inference data as crucial to accelerating the use of AI/ML in EDA. This data model would provide a foundation for addressing the data organization gap for chip developers, EDA tool developers, IP providers, and researchers. It would support design data and derived data for high-interest use cases.”

The white paper also identified a common reference flow, online AI/ML courses and organized training data as industry needs.

“Brought together by their shared interest in artificial intelligence and machine learning, the authors shared their unique perspectives and experience to emphasize the importance of data to any ML solution for EDA,” Clevenger said.

Power of Partnerships winners for 2021 are:

  • Kerim Kalafala, IBM, Chair
  • Veeravanallur Parthasarathy, Advanced Micro Devices
  • Norman Chang, Ansys
  • Akhilesh Kumar, Ansys
  • Elias Fallon, Cadence Design Systems
  • Sriram Madhavan, GLOBALFOUNDRIES
  • Prateek Bhansali, Intel
  • Srinivas Bodapati, Intel
  • Chandramouli Kashyap, Intel
  • James Masters, Intel
  • Ramy Iskander, Intento Design
  • Larg Weiland, PDF Solutions
  • Karthik Aadithya, Sandia National Laboratory
  • Boon-Siang Cheah, Synopsys
  • Mengdi He, Synopsys

Based on member and officer recommendations, Si2 executives submit nominations for the Power of Partnerships Award from which the Si2 board of directors then selects the winners.

Runners-up for 2021 are:

Compact Model Coalition, Open Model Interface Working Group
Colin Shaw, Chair, Silvaco

Contributed to Si2 initially by Taiwan Semiconductor Manufacturing Company, OMI is built around the TSMC Model Interface. OMI allows circuit designers to simulate and analyze such significant physical effects as self-heating and aging, and to perform extended design optimizations, including statistical modeling of process variations.

OpenAccess Coalition, Polygon Operators Working Group
James Masters, Chair, Intel

The Polygon Operators Working Group develops oaxPop, an API extension used with Si2 OpenAccess, the world’s most widely used open reference database for IC design. Originally contributed to Si2 by Intel, oaxPop brings the power of the popular Boost Polygon Library into the expanding OpenAccess design database ecosystem.

Hongmei Li Named IBM Representative to Si2 OpenAccess Coalition

Hongmei Li is the new IBM representative to the Si2 OpenAccess Coalition.  Li currently manages the Product Design Enablement Group in the IBM electronic design automation organization. She replaces Paul Stabler, a long-time supporter of OpenAccess activities, who is retiring from IBM.

Over her 17-year IBM career, Li has worked on radio-frequency MOSFET and passive device models, gate resistance characterization, de-embedding methodology for RF measurement, FET local layout effect, 3D through-silicon-via stress modeling, test site macro design and test site coordination. Starting August 1, she will manage the EDA Technology Enablement & ChipBench Group.

Li received a Ph.D. in Electrical Engineering from the University of Illinois at Champaign-Urbana in 2004.

Si2 OpenAccess, the world’s most widely used, open-reference database for IC design, creates authentic interoperability between EDA companies and semiconductor designers and manufacturers.

Views from the Cloud: Si2 Annual Technology Forum

The growing impact and productivity gains of designing semiconductors in the cloud comprise the focus the Si2 Annual Technology Forum, an online event scheduled for Friday, August 6, from 8:00 a.m. – to 10:00 a.m. Pacific Standard Time.

Registration is free. For details click here.

Silicon Integration Initiative is an R&D joint venture providing standard interoperability solutions for semiconductor design tools. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.


Keynote PresentationSilicon-to-System – Addressing Design, Verification, and Implementation Challenges with Cloud-Based Engineering

David Pellerin
Head of Worldwide Business Development
Amazon Web Services

Executive Panel Discussion:
EDA-in-the-Cloud Challenges are Already Solved by Providers

Kerim Kalafala
Senior Technical Staff Member

Ramond Rodriguez
Senior Director of Strategic CAD Capabilities

Dr. Rhett Davis
Professor of Computer and Electrical Engineering
NC State University

Rajeev Jain
Senior Director of Technology

Si2 Technical Coalition Updates

OpenAccess, oaScript Extensions
Marshall Tiner
Si2 Director of Production Standards

Standard Compact Models
John Ellis
Si2 President and CEO

AI/ML, Unified Power Models
Dr. Leigh Anne Clevenger
Si2 Director of OpenStandards

Special Announcement

Learn about a new Si2 industry initiative focusing on silicon-to-system design interoperability

Vic Kulkarni
Si2 Chief Strategy Officer

Annual Power of Partnerships Award

Presented to the Si2 team that has made the most significant contributions to the field of electronic design automation


Executives from Cadence, SK Hynix Join Si2 Board of Directors

AUSTIN, Texas—Silicon Integration Initiative, a leading research and development joint venture providing standard interoperability solutions for semiconductor design tools, announced today the election of its board of directors for 2021-2022.

Joining the Si2 board for their first full terms are:

  • Aparna Dey, Senior Product Marketing Group Director, Cadence Design Systems
  • Do Chang-Ho, Vice President, Computer Aided Engineering Division, SK Hynix

Re-elected board members are:

  • Richard Trihy, vice president, Design Enablement, GLOBALFOUNDRIES
  • Roger Carpenter, hardware engineer, Google
  • Leon Stok, vice president, Electronic Design Automation Technologies, IBM
  • Rahul Goyal, vice president, Intel Corp., director, R&D Strategic Enablement
  • Pankaj Kukkal, vice president, EDA, Emulation and Post-Silicon Engineering, Qualcomm Technologies
  • Jung Yun Choi, corporate vice president, Electronics Design Technology, Samsung Electronics
  • Juan C. Rey, vice president of engineering, Calibre, Siemens EDA
  • David DeMaria, corporate vice president, Strategic Initiatives and Market Intelligence, Synopsys
  • Keith Green, distinguished member of the technical staff, Texas Instruments

The board elected prior board member, John Lee, general manager and vice-president, Ansys, as an ex-officio board member. Lee will advise the board with regards to Si2’s long-term strategy for design-in-the-cloud, as well as for artificial intelligence and machine learning-enabled design.

The Si2 board represents leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers. Si2’s key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.

About Si2

Founded in 1988, Si2 provides standard interoperability solutions for semiconductor design tools. All Si2 activities are carried out under the auspices of the National Cooperative Research and Production Act of 1993, the fundamental law that defines R&D joint ventures and offers them a large measure of protection against federal antitrust laws.