Joydip Das, staff engineer at Samsung Austin Research & Development Center in Austin, Texas, has received the quarterly Silicon Integration Initiative Pinnacle Award. This award recognizes volunteers for their exceptional contributions to Si2’s success as a leading semiconductor R&D joint venture.
Das was selected for his contributions to the Si2 AI/ML in EDA Special Interest Group, which he chaired since its creation in October 2019. Under his guidance, the group wrote three white papers, conducted a successful industry survey, offered an AI/ML workshop with over 100 attendees, and delivered five conference papers.
“Joydip has proven to be an exceptional leader, forming subgroups to accomplish deliverables on topics of interest to our member companies. He encourages participation by professors and graduate students, helping the SIG recruit over 20 member companies and universities,” said Leigh Anne Clevenger, Si2 director of OpenStandards.”
Das earned his Ph.D. in Applied Science from the Department of Electrical & Computer Engineering at the University of British Columbia (UBC), Vancouver, Canada. He has publications in peer-reviewed IEEE and ACM journals and conferences.
About the Silicon Integration Initiative
Si2 is a leading research and development joint venture that provides standard interoperability solutions for IC design tools. Its primary products include OpenAccess, the world’s most widely used, open-reference database for IC design, and the Compact Model Coalition, which provides an avenue to fund standard compact SPICE models and standard interfaces for simulation tool interoperability.