https://si2.org/wp-content/uploads/2017/05/James_Church_system_level-2.png 180 270 Phillip Isenhart https://si2.org/wp-content/uploads/2016/03/si2_xpt-rgb-no-TM-copy-hue-300x230-2-300x230.png Phillip Isenhart2017-05-04 20:58:402017-05-08 19:17:54System level co-design of chip, package and PCB using native design databases in a unified 3D cockpit
System level co-design of chip, package and PCB using native design databases in a unified 3D cockpit
Author: James Church
Today’s advanced packaging design requires low layer count and high pin density to satisfy the cost pressures facing the electronics industry. By leveraging the native design formats, rules and technologies of each substrate designers can achieve a cohesive, optimized and properly constrained product.
Combining the OpenAccess IC layout database and Zuken’s own Package/PCB database format into a single hierarchically linked 3D system, enables system level optimization and visualization for a top-down or bottom-up flow that is not achievable in discrete point tools.
This paper was voted “Best Paper” by an audience survey taken after every presentation.