CHIP – PACKAGE CO – DESIGN ( OPEN3D ) Membership Agreement

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Membership in the Si2 Chip-Package Co-Design (aka (Open3D))  requires agreement to the following documents.

First:   CHIP-PACKAGE CO-DESIGN (OPEN3D)MEMBERSHIP AGREEMENT

Second:  DTMC__DFMC__Operating_Policy-1.pdf:  Attachment C- Project IP Policy

 

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