CHIP – PACKAGE CO – DESIGN ( OPEN3D ) Membership Agreement
Membership in the Si2 Chip-Package Co-Design (aka (Open3D)) requires agreement to the following documents.
First: CHIP-PACKAGE CO-DESIGN (OPEN3D)MEMBERSHIP AGREEMENT
dtmc__dfmc__agreementSecond: DTMC__DFMC__Operating_Policy-1.pdf: Attachment C- Project IP Policy
dtmc__dfmc__operating_policy