https://si2.org/wp-content/uploads/2016/02/Tom_Whipple_sq-e1492632352671.jpg 200 200 Phillip Isenhart https://si2.org/wp-content/uploads/2016/03/si2_xpt-rgb-no-TM-copy-hue-300x230-2-300x230.png Phillip Isenhart2017-04-19 20:12:162017-04-19 21:01:01Tom Whipple Reelected Chair of Si2 Chip-Package Co-Design Group
Tom Whipple Reelected Chair of Si2 Chip-Package Co-Design Group
Tom Whipple, solutions architect at Zuken, has been reelected chair of the Si2 Chip-Package Co-Design Technical Advisory Board. The TAB’s primary goal is to identify problems in chip-package-board design flows, and flows and data exchange solutions to solve them.
At Zuken, Tom is responsible for defining, promoting and supporting chip-package-board co-design solutions using Zuken CR-8000 design tools.