Latest OpenAccess News
OpenAccess Members
Advanced Micro Devices, Inc.
Agile Analog
Anaglobe Technology, Inc.
Analog Rails/Get2Spec, Inc.
ANSYS, Inc.
Avatar Integrated Systems, Inc.
AWR Corp, a National Instruments Corp.
Blue Cheetah Analog Design
Cadence Design Systems
Chengdu Higon IC Design Co., Ltd.
CST–Computer Simulation Technology GmbH
Dassault Systemes
DXCorr Design, Inc.
Empyrean Software
Entasys Design, Inc.
Fractal Technologies, Inc.
Google LLC
Hewlett Packard Enterprise
HW21
IBM Corporation
Intel Corp.
INTENTO DESIGN SAS
Invecas Inc.
Jedat Inc.
Keysight Technologies
Lattice Semiconductor Corporation
Life Technologies Corporation, a part of Thermo Fisher Scientific Inc.
Luceda Photonics N.V.
MediaTek
Mentor, a Siemens Business
Microsoft
Mythic, Inc.
Numem Inc.
PDF Solutions, Inc.
Phoelex
Pulsic Limited
Qualcomm Technologies, Inc.
Samsung Electronics Co., Ltd.
Savarti, Inc.
Silvaco, Inc.
Synopsys, Inc.
Taiwan Semiconductor Manufacturing Company Limited
Zuken, Inc.
Si2 oaScript Symposium: Scripting Made Easy
/in Frontpage, oaScript, OpenAccess /by Phillip IsenhartSi2 oaScript Symposium: Scripting Made Easy DAC 2017 Austin Convention Center, Room 7 Tuesday, June 20, 2017, 1:00 – 3:00 p.m. Can you easily write new applications for your users? We’ll show you how. Can you easily integrate script tools into your applications? We’ll show you how. Do your applications have a fast-track learning system? […]
System level co-design of chip, package and PCB using native design databases in a unified 3D cockpit
/in Chip Package Co-Design, OpenAccess, Uncategorized /by Phillip IsenhartAuthor: James Church Today’s advanced packaging design requires low layer count and high pin density to satisfy the cost pressures facing the electronics industry. By leveraging the native design formats, rules and technologies of each substrate designers can achieve a cohesive, optimized and properly constrained product. Combining the OpenAccess IC layout database and Zuken’s own […]