TITAN Roundtable Event
Friday, May 13, 2022
Click to watch the event playlist featuring speakers from
Ansys, Arm, IBM, Intel, Intento Design, Microsoft, NC State University, and Synopsys
TITAN Members may access the presentation slides here.
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Part 1 | Introduction to TITAN | Vic Kulkarni, Si2
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Part 2 | Challenges in 2.5D/3D-IC: An IP Perspective | Rob Christy, Arm
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Part 3 | 2.5D/3D Multi-Die Design Landscape & Opportunities | Shekhar Kapoor, Synopsys
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Part 4 | Roundtable Discussion
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Kerim Kalafala, IBM
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Ramy Iskander, Intento Design
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Akhilesh Kumar, Ansys
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Hui Fu, Intel
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Prashant Varshney, Microsoft Azure
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Rhett Davis, NC State University
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5G / 6G
AI / ML
Autonomous
HPC + Cloud
3D-IC
What We Do

Determine the best path forward for industry collaboration
Commit resources to develop and prototype gap technologies
How We Function
TITAN Council
High-Level Vision and Direction

TITAN Satellites
Execution and Feedback
Data Management & Workflows
Chair: Natesan Venkateswaran, IBM
Co-Chair: Chris Mueth, Keysight
2.5D / 3D-IC
Interim Chair: Rob Christy, Arm
Co-Chair: Rob Aitken, Synopsys
Secure ProcEssEd Data (SPEED) API
Chair: Akhilesh Kumar, Ansys
Co-Chair: Richard Taggart, IBM
TITAN Launch
TITAN Referenced in Semiconductor Investor Report
Please contact Leigh Anne Clevenger, Vice President of Technology, with any questions.
