The Silicon Integration Initiative has announced the addition of James Culp, a GlobalFoundries corporate fellow, to its board of directors. He replaces Richard Trihy, who served on the Si2 board for eight years.
Culp, who currently leads the GlobalFoundries CAD and design methodology teams, has more than 30 years of semiconductor industry and military experience. His teams are responsible for deploying 3Di design kits for RF/AMS applications utilized in next-generation consumer and A&D applications.
Culp is IBM Master inventor and a Si2 Distinguished Service Award recipient. His expertise also includes parametric yield modeling, DTCO/STCO application development and AI-based design methodologies