The Compact Model Coalition of the Silicon Integration Initiative (Si2) has issued a call for papers for its inaugural International Compact Modeling Conference (ICMC), scheduled for June 26-27, at the Cliff Royal Sonesta Hotel, San Francisco.
Researchers, academics, and industry professionals are invited to submit proposals for ICMC, which will explore the theme of “Strengthening Model Collaboration with the Semiconductor Industry.” Co-sponsored by IEEE EDS, ICMC will focus on compact device models, their development, and their broad application in the semiconductor industry.
The abstract submission deadline is January 15, 2025. Click here for complete details on the call for papers and the conference.
