23 Aug 2024 Terry Berke
Daniel Cross of Cadence Wins Si2 Pinnacle Award
Daniel Cross, senior principal solutions engineer at Cadence Design Systems, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for professional contributions to Si2's success as...
2 Aug 2024 Leigh Anne Clevenger
CMC Q3 2024 Meeting at KIOXIA in Yokohama, Japan
The Compact Model Coalition Q3 meeting is September 19-20, 2024, hosted by KIOXIA at their Yokohama Technology Site. Holding the meeting in Japan allows participation by local teams of member...
16 Jul 2024 Rob Aslett
LLM-Aided Design Workshop: Si2-sponsored Panel Receives Praise
Si2 sponsored an insightful panel discussion at The First IEEE International Workshop on LLM-Aided Design (LAD'24) on June 28, held at the IBM Almaden Research Center with over 200 attendees....
6 Jul 2024 Rob Aslett
Q2 2024 CEO Message
Si2’s value to our member companies is a result of the collective leadership and collaborative efforts of Si2 staff and leaders from member companies and academia. This has never been...
3 Jul 2024 Rob Aslett
Shahriar Moinian of Broadcom Wins Si2 Pinnacle Award
Shahriar Moinian, distinguished engineer at Broadcom Corp., has won the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2’s success as a leading semiconductor research...
3 Jul 2024 Rob Aslett
Larg Weiland of PDF Solutions Wins Si2 Pinnacle Award
Larg Weiland, a technical fellow at PDF Solutions, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, which is presented for exceptional contributions to Si2's success as a...
3 Jul 2024 Rob Aslett
OpenAccess Coalition Progress on Usability and Extensions
The Si2 engineering staff that facilitates and supports more than 45-member companies has doubled in size in the last year with the goal of improving usability. Christy Pack joined in...
3 Jul 2024 Rob Aslett
NXP Semiconductors Executive Reelected Si2 Board Chair 24-25
Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been reelected to a third term as board chair of Silicon Integration Initiative for 2024-2025. Kukkal joined the...
3 Jul 2024 Rob Aslett
Special Interest Group on AI/ML in EDA Picks up Steam
The AI/ML in EDA SIG explores how best to apply AI for chip design, help identify technical standards opportunities, and recommend high-value prototype projects with the goal of supplementing proprietary...
