Taming the 3D-IC Wild West” Quote from NAPMP..”
3D-IC brings together previously-separate domains of chip and system design with package design. Also, this technology brings additional challenges in power and thermal design and in testability. Advanced 3D-IC packaging has been called a “wild west,” where a lack of standards means that each company that wants to participate has to figure out a lot on its own.
As a member of the 3D-IC SIG, you will work together with experts from EDA companies, design companies, foundries, and OSATs to find opportunities for standards and beneficial shared utilities. You will work with the other SIG members to build and maintain an understanding of the landscape and the areas where standardization may provide the most benefit.
The 3D-IC SIG provides a collaborative opportunity to exchange insights and knowledge with design, fabrication, assembly, and EDA leaders. Being a member provides the opportunity to influence the direction of standards and shared utilities.
Design teams can share their challenges and needs with respect to 3D-IC standards, flows, etc., and gain insights from others in the industry.
By collaborating with design and EDA experts in the SIG, 3D package suppliers can get insights into challenges faced by their customers, and about future needs and directions.
Package suppliers can provide direction about standards and about utilities which may be helpful to them and their customers.
Design teams can help influence the direction of standards and utilities to ensure that the standards and utilities will meet their needs.
EDA tool suppliers can help shape emerging standards, and they can get early access to information that could be helpful in enhancing their design suite.
